| ： | XCVC1702-1MLINSVG1369 |
|---|---|
| ： | System On Chip (SoC) |
| ： | Xilinx (AMD) |
| ： | IC VERSAL AI-CO |
| ： | - |
| ： | Tray |
| ： | 0 |
| ： | 1 |
1
$25,261.2500
$25,261.2500
| TYPE | DESCRIPTION |
| Mfr | Xilinx (AMD) |
| Series | Versal™ AI Core |
| Package | Tray |
| Product Status | ACTIVE |
| Package / Case | 1369-BFBGA, FCBGA |
| Speed | 600MHz, 1.3GHz |
| RAM Size | 256KB |
| Number of I/O | 500 |
| Operating Temperature | -40°C ~ 110°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Primary Attributes | Versal™ AI Core FPGA, 1M Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DDR, DMA, PCIe |
| Supplier Device Package | 1369-FCBGA (35x35) |
| Architecture | MPU, FPGA |
